Technical Advantages

◇ One stop service, including design simulation, wafer test, packaging, finished product test, system level test, etc.
◇ Complete package types, including frame package (SOT, SOP, QFN, DFN, LQFP, TO, IPM, etc.), substrate package (WBBGA, WBLGA, FCBGA, FCCSP, FCLGA, etc.) and wafer package (Fan in WLCSP, Fan out WLCSP, Cu pillar bump, Solder bump, Gold bump, etc.), as well as COG, COF and SIP.
◇ Rich product categories are widely used in consumer, industrial and automotive products, including high-performance computing, big data storage, network communication, mobile terminals, vehicle electronics, artificial intelligence, Internet of Things, industrial intelligence and other fields.
◇ The leading vehicle packaging test OSAT in China, with nearly 20 years of vehicle packaging test experience.
◇ The domestic leading power device packaging test OSAT, in addition to the traditional TO series packaging, has established the packaging test capabilities of Toll, LFPAK, IPM, and Power Module
◇ 7nm wafer node product packaging test capability, leading high-performance Flip Chip product packaging test capability.
◇ Have driver IC and memory packaging and testing capabilities.
◇ Three temperature test capability, strip test capability, high-power IGBT module test capability and system level test capability with ATC function.